Flexible Electronics News

imec: New Insulation Technique Paves Way for More Powerful, Smaller Chips

The technique uses metal-organic frameworks, a new type of materials consisting of structured nanopores.

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By: Anthony Locicero

Copy editor, New York Post

Researchers at KU Leuven and imec have successfully developed a new technique to insulate microchips. The technique uses metal-organic frameworks, a new type of materials consisting of structured nanopores. In the long term, this method can be used for the development of even smaller and more powerful chips that consume less energy. The team has received an ERC Proof of Concept grant to further their research. Chips are getting smaller and their processing power is increasing. Nowadays, a c...

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